Component-Level Recovery. Zero-Defect Batches.

Component-Level Rework

Trace reconstruction, pad repair, and BGA reballing for surface-mount components, ensuring integrity down to the micro-scale.

Tolerance & Quality Control

Every recovered board undergoes calibrated oscilloscope display checks and thermal imaging verification to meet industrial specifications.

Standardized Mojave Lab Intake

Diagnostic Audit

Remediation Protocol

Optical Inspection

Final Delivery

Initial assessment and failure analysis to pinpoint exact component-level issues.

Precision micro-soldering and component replacement following strict engineering guidelines.

High-magnification visual inspection and electrical testing for zero-defect recovery.

Secure packaging and dispatch of specification-compliant, flight-ready hardware.

Ready to Ship Your Test Batch?

Connect with our Mojave facility for immediate project intake and expert hardware remediation.